ALPHA Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Alpha Lab

All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab

Current Research

Surface Engineering Enhancement of Advanced Cooling Technology

Micro-bump Bonding, Cu/dielectric Hybrid Bonding and Characterization

Through Glass Via for 3D Heterogenous Integration

Advanced Semiconductor Nanoscale 3D Interconnections

Hot Spots Targeted Cooling Technologies

Thermomechanical Reliability Modeling & Characterization of Advanced Packaging

Materials, Processing & Architecture Development for Semiconductor Packaging

Electronic Cooling & Efficient Thermal Packaging Materials

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Featured Publications

Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, International Conference on Synchrotron Radiation Instrumentation (SRI) 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

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Media

Featured News

AlphaLab at 2023 SCALE SURF

We showed our work at the 2023 SCALE SURF Symposium! Thank everyone for the great work during the summer. Congratulations!

Alpha Lab and TRACE Lab BBQ

We had an exciting BBQ organized in collaboration with Prof. Yan Gu’s group. What a memorable gathering! Prof. Yan Gu’s group (TRACE lab): [Group link: https://www.thetracelab.com/team.html ]

New Postdoc Position Available!

Our lab has a new postdoc position available with the topic of AI-driven design of hotspot-targeted microjet impingement systems. Please click the link below for details: Physics-informed AI-Driven Design and Fabrication of Hotspots-Targeted Microjet Cooling for High-Performance Computation Systems https://engineering.purdue.edu/Engr/Research/GilbrethFellowships/ResearchProposals/2024-25/physicsinformed-aidriven-design-and-fabrication-of-hotspotstargeted-microjet-cooling-for-highperformance-computation-systems

Prof. Wei delivered a 2-hour short course at NSF POETS Center

The short course was great – we had 59 ppl logged in and learning from Tiwei! POETS VIRTUAL COURSE SERIES REGISTER HERE Course Summary: Thermal management directly impacts the cost, performance, and reliability of the electronic/electrical components and systems in wide ranging applications including computing, communications, defense systems etc. The electrification of transportation is one of the […]

Attending ITherm 2023

Prof. Wei and Shuhang attended IEEE ITherm and ECTC 2023! Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. At this year’s event, Purdue faculty were very involved in the conference organization: Amy Marconnet was […]

From micro to macro: cooling data centers from the inside out

Dr. Wei’s team has received a $1.9 million Department of Energy grant to help make data centers more energy efficient! See the news from Purdue ME for the details: From micro to macro: cooling data centers from the inside out – Mechanical Engineering – Purdue University

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