We took group photos at Birck Nanotechnology Center!
Thank Mr. Jared Pike for taking the nice photos!
Making Semiconductors Dense and Cool
We posted a featured blog on the CoE Medium homepage to introduce our lab! Making semiconductors dense and cool | by Purdue College of Engineering | Purdue Engineering Review | Jan, 2023 | Medium
Research Position Openings for Summer Undergraduate Research Fellowships (SURF) 2023
Our lab has 4 SCALE SURF positions for this summer, with topics of advanced packaging and heterogeneous integration. Those projects are from SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://lnkd.in/gfMaX6cT to […]
Alpha Lab performed experiments at APS
Alpha Lab collaborated with Prof. Jiawei Mi to perform experiments at the Advanced Photon Source (APS) – Argonne National Laboratory.
Alpha Lab got NSF funding
Prof. Wei will work with Prof. Dan Jiao and other colleagues on a new NSF funded grant “FuSe-TG: Open, Multiscale, Application-Agnostic Platform for Heterogeneous System-in-Package Co-Design”
Prof. Wei elected as Technical Program Chair for the 2023 IEEE REPP
Prof. Wei was elected as Technical Program Chair for the 2023 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP).
Alpha Lab receives 3-year funding from SRC
Alpha Lab receives 3-year funding from Semiconductor Research Corporation – SRC, for the 3D interconnects processing and thermomechanical characterization, collaboration with Prof. Thomas Beechem. The project will start from January 2023.
Shuhang Lyu received “Best Student Presentation Award” in 2022 IEEE REPP
Shuhang Lyu received “Best Student Presentation Award” in 2022 IEEE REPP for his great work on “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling” [Video].
Presented our recent research results in IEEE REPP 2022, great work!
Alpha Lab presented our recent research results in IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) on 9-10 November 2022 at Texas Instruments, Santa Clara, CA USA. Shuhang Lyu presented his recent work on “Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling”[Video]. Zheng Gong presented his work with the title “Thermomechanical […]