Parnika Gupta is currently completing her PhD research, which focusses on the design, assembly, and testing of glass interposers for co-packaging photonic integrated circuits and electronic integrated circuits under the supervision of Prof. Peter O’Brien at Tyndall National Institute. The aim for her research is to get design and assembly rules around moving to scalable […]
Dr. Wang received his bachelor degree in chemistry at Shanghai Jiaotong University and doctoral degree in materials science at Stanford University. After finishing phd, he was employed by HiSilicon Company as an IC packaging engineer, focusing on the reliability of novel packaging designs. Yang is dedicated to doing research and involves himself in new discoveries […]
Dr. Ketan Yogi is postdoctoral research scholar at Purdue University, School of Mechanical Engineering. Before joining Purdue University, he worked as post-doctoral research fellow in Indian Institute of technology (IIT) Bombay, INDIA from 2022 to 2023. He was working on the heat transfer with the combination of jet impingement and periodic metal foam using IR […]