Dr. Dongkai Shangguan, IEEE Fellow, is currently a visiting scientist at Prof.Wei’s Alpha Lab. He also severing as an advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President at Flex (formerly Flextronics) and at STATSChipPAC (currently JCET). Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon.
Dr. Shangguan’s research interests include: advanced semiconductor packaging, heterogeneous integration and SiP for miniaturized functional modules, flexible hybrid electronics, advanced materials, thermal management and reliability. He has published two books, authored/co-authored over 200 technical papers, and has been issued 28 U.S. patents.
Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama. Dr. Shangguan served as Adjunct Faculty at Wayne State University and as a guest professor at several universities, and has supported/advised several graduate research projects over the years.
Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.