Our lab have 4 SCALE SURF positions for this summer, with topics of advanced packaging and heterogeneous integration.
Those projects are from SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://lnkd.in/gfMaX6cT to view all of the SCALE SURF research projects for summer 2023.
Nano Hub postings: https://nanohub.org/groups/scale/research_su23
Project Descriptions: https://lnkd.in/g7Es9uJm
Bachelor, Master, or Ph.D. degree in Mechanical engineering, Electronic engineering, or Materials Engineering, related to electronic packaging and thermal management.
Familiar with the Semiconductor fabrication process and advanced electronic packaging technologies, Numerical modeling, Heat and mass transfer theory, CFD modeling, Fluid mechanics, Thermomechanical modeling, and Thermodynamics.
Excellent GRE and TOEFL or IELTS test scores, good academic writing skills, literature reading, oral presentation, and communication skills.
Great teamwork, projects collaboration and self-learning abilities.