Heat and Mass Transfer in Confined Impingement Jets and Microchannels

Lin, Yujui, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, and Kenneth Goodson. “Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module.” Journal of Electronic Packaging (2023): 1-45.

Oprins H, Wei T, Cherman V, et al. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study[C]//2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2023: 1-10.

H Oprins, Tiwei Wei, Vladimir Cherman, E Beyne (2023, May). Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD–FEM modeling study. In 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-10). IEEE.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022.

Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers. Journal of Electronic Packaging 2022. DOI: 10.1115/1.4055468 [PDF]

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865.

Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021, Volume 182, 121865. DOI: 10.1016/j.ijheatmasstransfer.2021.121865 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns, Applied Thermal Engineering, Volume 180, 5 November 2020, 115767.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns, Applied Thermal Engineering, Volume 180, 5 November 2020, 115767. DOI: 10.1016/j.applthermaleng.2020.115767 [PDF]

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145.

Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145. DOI: 10.3390/fluids4030145 [PDF]